Team Status Report for 3/21/26

The most significant risk at the moment is the time needed to integrate and test all of our components when our sensor PCB gets in. The rest of our component functionality more or less depends on how well the optical sensor works, and we still need to receive and bring up the PCB. Once this is done though, we should be able to make significantly more progress in the next week and be ready for the interim demo. As stated before our contingency plan is that we have multiple components for our sensor and MCU, and should something not go as planned, we will at least have basic functionality by the interim demo, and time after that to address any issues.

No design changes or schedule updates have been made since last week.

Here are a couple iterations for our stylus housing and MCU fit that we are still iterating.

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