This week I worked more on iterating the 3D housing, as well as planning out testing for when we receive our sensor.
For the 3D housing, I allocated ~1mm of extra space for each component to account for manufacturing differences, and I rearranged the parts so that our MCU can be closer to the tip where users will likely hold the pen, so that our IMU can be more accurate. I also separated out the portion of the housing for the tip so that I can slim out the rest of the body, which will allow for a more comfortable writing experience. I also had to adjust the tip dimensions to account for our new optical sensor.
I haven’t made much progress with the conversion module since I already have the software side of it down as much as I can without having the sensor. Going further with tuning the conversion module has been bottlenecked by our troubles with getting a sensor, so when we actually do have it physically and integrated with our PCB, I can continue in tuning and testing the conversion module for the latency and CPI setting of our physical part. My progress is a bit behind because of this, but since we have our MCU’s in-hand now, I plan to send some “fake” CPI data from the MCU to try and better prime the conversion module for the real data when we get our sensor physically. This, in addition to cutting down in weight on our 3D housing by trimming excess plastic, is what I plan to get done in the next week.