Accomplished:
Finished fabricating V2 of our chip, yield rate is much better and the measured results are consistent. Then pass it on to Charlie and Jim on measurement and help them set up the probe station.
Progress/Schedule:
Currently working on wirebonding the last chip since probing 6 pads at the same time prove to be difficult, and we have recognized a potential issue with the design, and are actively working on a V3 design.
Upcoming Deliverables:
By next week, we should have V3 done if fabrication goes well, the recent spill of Type A Al Etchant disabled the wet etch bench in the Hackerfab. Jay told us that it can be fixed by the end of the week, so I plan on finishing V3 during the weekend.