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Ethan’s Status Report for 4/25

Accomplished:
I have received feedback on our V2 chip, there are few issues that need to be addressed. First, the bond pads need to be increased due to the difficulties last time. Also, there has been a design flaw from Charlie’s end where an additional resistor is needed between gate and ground, I have since completely reworked all of my etch masks to address this change in design. V3 is currently under fabrication.

Progress/Schedule:
I have managed to begin and complete the first few processes of the fabrication as of Saturday night. However there has been an issue with RIE etching as Hackerfab ran out of SF6. I am currently communicating with Jay to see if the delivery can be made before Monday, otherwise, I will have to use the 790 RIE from the nanofab as an alternative. I’m suspecting some parameter changes due to different machinery, but due to the selectiveness of SF6 on polysilicon and silicon oxide, the task should still be manageable. That does delay my timeline by a day or two, which may cause issues.

Upcoming Deliverables:
My plan is to deliver V3 by Monday for Jim and Charlie to test and finalize their part. The previous v2 has shown great properties that are nearly 100% consistent with expectation, therefore, I believe that if our calculation is done right without design oversight, this could very much work right off the bat. There will be 4 functional devices on the next chip, which I will cleave into individual chip before wirebond, which will then directly integrate into the PCB.

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Team Status Report for 4/25

Progress:
This week, the team focused on final-stage oscillator testing for V2, V3 fabrication, PCB assembly, and final demo preparation. During testing, the circuit was able to turn on the LEDs, which was an encouraging sign that the chip and external setup were producing meaningful output behavior. However, confirming actual oscillation remained difficult because the setup required six delicate probe connections routed into a breadboard. Even very small wire or probe movement could disrupt the contacts, which made it hard to reliably connect the oscilloscope or additional inspection circuitry. The team also observed some unexpected test point voltages, but because of the instability of the probing setup, it was difficult to determine whether those came from the device, the circuit, or the measurement setup. Jim worked on PCB soldering and integration preparation, with the main remaining dependency being final confirmation of the off-chip capacitor values. Ethan focused on V3 fabrication and the updated wirebonding path after the V2 aluminum adhesion issue. Charlie supported the circuit side by providing schematic revisions, design ideas, and value calculations to guide the final testing and V3 approach.

Schedule/Updates:
The team is still progressing toward the final demo, but the schedule is tight because V3 fabrication, wire-bonding, characterization, and integration all need to happen quickly. Compared to last week, the main update is that V2 showed promising LED behavior, but we still cannot confidently claim stable oscillation without reliable oscilloscope confirmation. The current limitation is not only circuit behavior, but also the practical difficulty of testing a six-pad device through manual probing and breadboard wiring. Because of that, V3 is now the main path for improving final validation. Once V3 is fabricated and wirebonded, testing should become much easier because the team can avoid delicate manual probing and instead use the chip holder and breadboard adapter for more stable circuit connections. This should make oscilloscope testing, voltage inspection, and overall demo integration much more practical.

Upcoming Deliverables:
For next week, the team’s main priorities are to complete V3 fabrication and wire-bonding, test the device using the chip holder and breadboard adapter, finish PCB integration, and prepare all final demo materials. Ethan will focus on completing V3 fabrication and supporting wire-bonding so the chip can be tested in a more reliable integrated setup. Jim will finish the remaining PCB soldering and integration work once the off-chip capacitor values are confirmed, while also supporting V3 characterization and final demo setup. Charlie will continue supporting schematic refinement, circuit value calculations, and testing strategy based on the results from V2 and V3. In parallel, the full team will work on the final handout/writeup, poster board, and video.

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Jim’s Status Report for 4/25

Accomplished:
This week, my work focused on final-stage oscillator testing and PCB assembly preparation. During testing, the circuit was able to turn on the LEDs, which was an encouraging sign that the chip and external setup were producing meaningful output behavior. However, confirming actual oscillation remained difficult because the test setup required six delicate probe connections routed into a breadboard. Even very small movements of the wires or probe pins could disrupt the connections, which made it hard to reliably attach the oscilloscope or additional inspection circuitry. We also saw some unexpected test point voltages, but because of the instability of the probing setup, it was difficult to determine whether these came from the device, the circuit, or the measurement setup. On the PCB side, I began soldering and preparing the board for final integration, with the main remaining dependency being confirmation of the final off-chip capacitor values.

Progress/Schedule:
My portion of the project is still moving forward, but the final stage is now constrained mainly by testing and integration limitations rather than material readiness. All PCB materials and supporting components are available, and the board is being assembled while we wait on final capacitor selection. The V2 testing results are partially encouraging because the LED behavior suggests activity, but we still cannot confidently claim stable oscillation without reliable oscilloscope confirmation. The team is also moving into V3 fabrication, which should address the V2 wirebonding issue caused by aluminum adhesion problems. The schedule is tight, but the project is still in a workable position for demo week if V3 characterization and integration go smoothly.

Upcoming Deliverables:
For next week, my main focus will be finishing PCB integration, supporting V3 characterization, and helping prepare the final demo materials. Once V3 is fabricated and wirebonded, testing should become much easier because we will no longer need to rely on delicate manual probing across all six pads. Instead, we can first use our chip holder and breadboard adapter to connect the device into the external circuit more reliably, which should make oscilloscope testing and further voltage inspection much more practical. Once the off-chip capacitor values are confirmed, I will also finish the remaining soldering and PCB integration work. In parallel, I will contribute to the final handout/writeup, poster board, and video so the final demo clearly explains both the design progress and the practical testing limitations we encountered.

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Charlie’s Status Report for 4/18

This past two weeks were mainly focused on revising the oscillator design and supporting probe station testing efforts as the team worked toward verifying whether the circuit could produce a stable oscillating output in practice. A large portion of my work involved re-examining the current oscillator schematic in light of the physical testing constraints we encountered, especially the difficulty of maintaining precise and reliable probe connections across a relatively large number of required pins. In parallel with Jim during probe station sessions, I helped think through how the existing setup could be tested more effectively and what schematic-level changes might make the design more practical for direct on-chip measurement. A major focus during this period was exploring alternative design approaches that could reduce the number of pins required during testing while still preserving the core oscillator behavior we want to demonstrate. This included considering revised schematic structures, simplifying supporting connections where possible, and evaluating whether certain design choices could make the probe station setup more robust against alignment and contact precision issues. The latest testing efforts were useful not only for checking for oscillation at the output, but also for identifying where the current design may be too difficult to reliably validate in its present form. Overall, this work helped move the project from simply trying to test the original design toward more actively refining the design around real measurement constraints, and although verifying oscillation remains challenging, these revisions and design discussions have put the project in a better position to improve testability and make the final oscillator demonstration more achievable.

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Ethan’s Status Report for 4/18

Accomplished:
Finished fabricating V2 of our chip, yield rate is much better and the measured results are consistent. Then pass it on to Charlie and Jim on measurement and help them set up the probe station.

Progress/Schedule:
Currently working on wirebonding the last chip since probing 6 pads at the same time prove to be difficult, and we have recognized a potential issue with the design, and are actively working on a V3 design.

Upcoming Deliverables:
By next week, we should have V3 done if fabrication goes well, the recent spill of Type A Al Etchant disabled the wet etch bench in the Hackerfab. Jay told us that it can be fixed by the end of the week, so I plan on finishing V3 during the weekend.

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Team Status Report for 4/18

Progress:
Over the past two weeks, the team made strong progress across characterization, fabrication, and hardware integration. Jim completed the demo PCB layout, finalized the BOM and remaining component selections, submitted the board for ordering, and received both the fabricated PCB and the remaining supporting materials needed for assembly. In parallel, he completed V2 transistor sweeps and resistance measurements at the probe station, then organized and summarized those results for design validation and final presentation use.

Ethan fabricated V2 for testing and measurement and, because the results looked promising, redeposited aluminum afterward so the devices could be tested more directly. He also began preparing for V3 so the next iteration can be finalized quickly if only minor resistance adjustments are needed. Charlie contributed by building the breadboard-level circuitry for oscillation testing and working through the analog testing setup, including determining the pin access and holder/interface requirements needed to connect the chip into the breadboard environment. Overall, the team has made substantial progress in moving from validation into final-stage testing readiness.

Schedule/Updates:
The team remains on schedule and is now entering the final stretch of the project. Compared to the previous update, the project is in a much stronger position because the demo PCB and materials are now physically in hand, V2 characterization has been completed with encouraging results, and the oscillation testing setup is much closer to ready. The latest measured values are much more aligned with the originally targeted design range than V1, which gives the team better confidence going into final presentation week and demo week. Oscillation testing is beginning tonight, so the next update should reflect whether the current iteration is already achieving the expected behavior or whether further V3 adjustments will be needed.

Upcoming Deliverables:
For next week, the team’s main priorities are to carry out final oscillation testing on the current iteration, confirm whether the measured values and integration setup produce the expected oscillator behavior, and prepare the final presentation materials. Jim will help organize the measured and benchmarked data for the presentation, prepare the demo PCB for final integration, and support continued testing and validation. Ethan will continue refining the chip iteration path and finalize V3 if small design adjustments are needed based on the oscillation results. Charlie will continue supporting the oscillation test setup and final presentation integration. Overall, the team’s next deliverables are to verify oscillator performance, prepare the final presentation, and move the hardware and chip integration into a demo-ready state.

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Jim’s Status Report for 4/18

Accomplished:
This past two weeks, I spent significant time on both the hardware integration and characterization sides of the project. On the hardware side, I completed the demo PCB layout, finalized the BOM and remaining component selections, submitted the board for ordering, and received both the fabricated PCB and all remaining supporting materials (PCB Components, related demo materials and adapters) needed for assembly on Friday. The hardware side is now largely prepared pending final assembly and the final capacitor value decision. A substantial part of my effort these last two weeks went into pushing the PCB and integration work from the design stage into a physically ready state for the final demo phase.

On the characterization side, I also spent a large amount of time at the probe station finishing V2 transistor sweeps and resistance measurements, then organizing and summarizing that data so it could be directly used for design validation and final presentation work. These updated V2 results were important because, unlike V1, the measured values now fall much more closely within our originally targeted range, which gives us stronger confidence in the current design iteration. In parallel, I also continued helping document the fabrication process in the lab with Ethan by recording footage of the workflow, so we now have a better record of both the fabrication process and the overall project progression. Overall, this week involved a heavy amount of hands-on work across PCB preparation, parts finalization, and measurement-driven validation, which has directly set up the immediate oscillation testing we are beginning tonight after this report.

Progress/Schedule:
I am currently on schedule for my portion of the project. At this point, most of the PCB, BOM, and materials work has been completed, and the main effort is now shifting toward final assembly, presentation preparation, and final verification of the chip behavior. The latest V2 characterization results are encouraging because they suggest the current iteration is behaving much closer to the intended electrical range, which puts the team in a better position going into final presentation week and demo week. With only two weeks remaining, the project is now in its final stage where the priority is making sure the measured data, integration, and final chip behavior all align with the expected oscillator design goals. We are also moving directly into oscillation testing tonight, so the next status update should reflect whether the current iteration is already demonstrating the expected behavior or whether further adjustments are needed.

Upcoming Deliverables:
For next week, my main focus will be helping Charlie prepare the final presentation by organizing the measured data and benchmarked iteration results, especially for transconductance, resistance, and verification that the key design values align with the oscillator conditions we are targeting. In parallel, I plan to solder and prepare the demo PCB so it is ready for final chip integration once the remaining capacitor value is selected. Beginning tonight, I will also support the immediate round of oscillation testing and continue helping verify that the measured behavior matches our expected benchmarks and that we are able to achieve and observe oscillation on-chip ahead of demo day the following week.

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Ethan’s Status Report for 4/4

Accomplished:
I let Jim and Charlie measure the chip that I fabbed last week and provide direction on specific parameters that I need to continue my fabrication process. They took those measurements and have provided me with direction for improvement for our next iteration. I have since modified the design and begun the fabrication process of the next iteration.

Progress/Schedule:
We are still recovering from the two weeks of lost in time as I’m not certain how many iteration it would take for us to get the chip starts to oscillate, there are many unknown variables from the fabrication stand point that really asks for multiple iterations, but I’m on track to deliver two more iterations based on the time remaining.

Upcoming Deliverables:
I’ll finish up the devices by wednesday before the spring carnival before I take a break and leave Pittsburgh, in the meantime, Charlie and Jim can work on measuring the devices so I can get ready to modify things for the next iteration immediately after I come back.

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Charlie’s Status Report for 4/4

This week I was mainly focused on demo PCB development and supporting the next oscillator iteration using the team’s latest characterization results. A large portion of my work involved coordinating with Jim on the demo PCB design and integrating the oscillator into the broader test and demonstration platform. In particular, I worked through schematic-level design details, including supporting connections, component choices, and the calculation and selection of capacitor values needed for the PCB implementation, and particularly making custom Capacitors for potential oscillation performance testing.

 

 

At the same time, the latest empirical measurements from the fabricated chip helped clarify the behavior of the design and provided useful direction for Ethan’s upcoming V2 iteration. By the end of the week, we finalized the demo PCB schematic, so the remaining work is now focused on physical layout, packaging, and submitting the board order by next Tuesday along with the final supporting materials. Overall, the schedule remains tight, but the project is now in a much better position because the design has moved into a more concrete stage of measurement-informed refinement and hardware integration.

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Team Status Report for 4/4

Progress:
This week, the team made strong progress on both characterization and hardware integration. A major focus was collecting empirical measurement data from the fabricated chip to support the next design iteration. Jim spent significant time at the probe station performing transistor sweeps, CVU measurements related to switching behavior, and resistance measurements across on-chip structures. These results gave Ethan the data needed to move forward with the V2 design iteration. In parallel, the team also finalized the demo PCB schematic, moving that work from schematic definition into layout and packaging.

Schedule/Updates:

The team remains on schedule, although the timeline is tight. Compared to last week, the project is now in a much better position because both characterization and PCB schematic work advanced significantly. The main immediate deadline is finishing the demo PCB layout and submitting the order by next Tuesday, along with ordering the remaining supporting materials for the demo setup.

Upcoming Deliverables:
Next week, the team’s main priorities are to complete the V2 design iteration using this week’s measurement results, finalize the demo PCB layout, and place all remaining orders by Tuesday. Ethan will use the characterization data to refine the next chip iteration, while Jim will focus on PCB layout and ordering the remaining components needed for the demo platform. Charlie will continue supporting integration of the finalized oscillator design into the demo setup. Overall, the team is in a good position to turn this week’s measured results into the next round of refinement and implementation.