Team Status Report for 4/18

Progress:
Over the past two weeks, the team made strong progress across characterization, fabrication, and hardware integration. Jim completed the demo PCB layout, finalized the BOM and remaining component selections, submitted the board for ordering, and received both the fabricated PCB and the remaining supporting materials needed for assembly. In parallel, he completed V2 transistor sweeps and resistance measurements at the probe station, then organized and summarized those results for design validation and final presentation use.

Ethan fabricated V2 for testing and measurement and, because the results looked promising, redeposited aluminum afterward so the devices could be tested more directly. He also began preparing for V3 so the next iteration can be finalized quickly if only minor resistance adjustments are needed. Charlie contributed by building the breadboard-level circuitry for oscillation testing and working through the analog testing setup, including determining the pin access and holder/interface requirements needed to connect the chip into the breadboard environment. Overall, the team has made substantial progress in moving from validation into final-stage testing readiness.

Schedule/Updates:
The team remains on schedule and is now entering the final stretch of the project. Compared to the previous update, the project is in a much stronger position because the demo PCB and materials are now physically in hand, V2 characterization has been completed with encouraging results, and the oscillation testing setup is much closer to ready. The latest measured values are much more aligned with the originally targeted design range than V1, which gives the team better confidence going into final presentation week and demo week. Oscillation testing is beginning tonight, so the next update should reflect whether the current iteration is already achieving the expected behavior or whether further V3 adjustments will be needed.

Upcoming Deliverables:
For next week, the team’s main priorities are to carry out final oscillation testing on the current iteration, confirm whether the measured values and integration setup produce the expected oscillator behavior, and prepare the final presentation materials. Jim will help organize the measured and benchmarked data for the presentation, prepare the demo PCB for final integration, and support continued testing and validation. Ethan will continue refining the chip iteration path and finalize V3 if small design adjustments are needed based on the oscillation results. Charlie will continue supporting the oscillation test setup and final presentation integration. Overall, the team’s next deliverables are to verify oscillator performance, prepare the final presentation, and move the hardware and chip integration into a demo-ready state.

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