Accomplished:
This week, I’ve further refined the RIE process, now it works pretty flawlessly. Thanks to some members of the Hackerfab, we now have many devices ready to be measured, some initial measurement has been done, more to come next week. I have since catched up with the process and should have my own first iteration this weekend.
Progress/Schedule
We have begun discussing the process for fabricating NMOS, resistor, and MOSCap on the same chip. The main challenge here is the diffusion step as right now, each of them requires different time in the furnace, plus NMOS process is much longer and has two diffusion processes compared to resistor or MOSCap so we are currently working on a process that can address this issue.
Upcoming Deliverables
Outline for the final process that we will use to fabricate our actual device, as we shift from initial testing to initial fabrication of our first iteration of devices. Once the measurements are in, we will have more information as to what our limitations are.