3rd October 2026
Added M2 mounting holes to the PCB (2.2mm diameter). Verified that all placement and routing on PCB design is correct and complete. Submitted the JLCPCB order for the minimum 5pcs, as well as all surface-mount / through hole components for the PCB:
1. 1 µF ±20% 50V Ceramic Capacitor X5R 0805 (2012 Metric)
2. Linear Voltage Regulator IC Positive Fixed 1 Output 600mA SOT-25 (AP2112K-1.8TRG1)
3. 0.1 µF ±5% 50V Ceramic Capacitor C0G, NP0 1206 (3216 Metric)
4. Harwin M22-2022005 (through-hole pins)
5. SamTec TCSD-20-D-06.00-01-N (ribbon cable for connecting PCB to FPGA)
6. SPH0641LU4H-1 Knowles Microphone
Worked on the design report, specifically on the justification for the microphone array design. Added all required equations for deriving the expected sound pressure level at a range of 10 feet, as well as array aperture sizing for angular resolution. Also added all equations justifying the design choice of the SPH0641LU4H-1 Knowles Microphone, deriving the self-noise floor of the microphone, and the operational signal-to-noise ratio picked up by the microphone array (after beamforming).
Goals for next week:
Wait for the arrival of the fabricated PCB and all the components, for surface-mount and through-hole soldering. This will be done in the TechSpark PCB Lab. After PCB assembly, to individually test every microphone for a data signal, before handing it off to teammates for the RTL bringup.