Accomplishment
Fabricated PCB arrived at ECE receiving office, as well as all the other components (to be soldered on the PCB). Finalized design report, specifically these sections: use-case requirements, microphone array subsystem (design requirements, design tradeoffs, system implementation). Also filled in section for design and verification.
Did a rough hand sketch of the 3D print mount that holds all the components together. The microphone array PCB will be mounted in front, using four M2 mounting screws. The Ultra96-V2 FPGA will be mounted right behind the microphone array, also using four M2 mounting screws. The Valore powerbank will be mounted behind the FPGA, slotted into a 3D printed slot. The LCD screen will be mounted right behind the powerbank, using four M2 mounting screws.
Schedule
On track
Goals for next week
Solder all components onto the PCB. This will be done in the TechSpark PCB Lab. After PCB assembly, to individually test every microphone for a data signal, before handing it off to teammates for the RTL bringup.