This week the whole team met and performed unit testing on the individual components of the broad circuit. We came across issues with the circuit that are currently being worked on and have halted further progress towards integration. One other issue identified was heat management, as such all ICs now have heatsinks, and a fan will be implemented in the final housing.
Circuit debugging is expected to be finished Monday so that unit testing may be finalized. Once that is done I plan to assemble the components together on Tuesday so that on Wednesday we can perform broad system testing and tuning, which has unfortunately been pushed back.