This week I completely assembled and soldered all of the circuitry components. This took longer than expected because of a defective soldering iron, but I did still manage to get it done. While yes I am behind schedule, my schedule is written with enough time throughout each section to allow some room for error. I hope next week to finish thermal testing.
Carnegie Mellon ECE Capstone, Spring 2026 – Caleb Doan, Jayson Ma, Jack Wang