BARI BOX: This past week, I finalized the CAD for the BARI BOX and had it 3-D printed at TechSpark. The partially-assembled box is shown below. There were a few glitches in the manufacturing process, namely defacing of the surface finish and some poor tolerances in the mounting holes which will require drilling for further assembly, but overall this box is sufficient to serve as a mockup case for our design.
REV 2 MANUFACTURING: Components for BARI Rev 2 began to arrive this week, kick-starting my manufacturing of the new boards. My progress on the first Rev 2 board is shown below: I’ve assembled most of the pre-amplifier and analog effect stages, with the UI, ADC, and microprocessor to come next week as the necessary components arrive. The BM83 for this board was resoldered from a Rev 1 board due to the global chip shortage preventing us from obtaining a new device. The shielding case was dislodged during the resoldering process, and further testing is required to ensure the SoC remains functional.
PRE-AMP VERIFICATION: Finally, the new and more easily-solderable amplifiers arrived with Rev 2, and by retrofitting one of them onto a Rev 1 board, I was able to verify clean audio amplification on that Rev 1 board, as shown below:
Assuming that I receive the parts I need for next week, my goals are to finish the Rev 2 manufacturing quickly enough to help my teammates get the software of our device finished.