This week, I mainly focused on modeling, cutting and assembling the final outer chassis of the entire system. I also helped with standardizing soldering practice for the hall effect sensor with Sizhe to ensure minimal variance for each piece so that we can avoid connection issues and minimize detection difference.
Schedule and risk wise, due to the consumption of the components, we are only on track for a working 6 by 6 board for the presentation next week. However, Sizhe designed a new improved PCB that is optimized for soldering ease and pathing which we will use for the final product.
Next week after the presentation, I will help with soldering the new PCB boards, further testing, and internal wire management for the final demo product.