What did you personally accomplish this week on the project?
This week I achieved a major breakthrough on the software side: I successfully got the imaging code working and was able to recover data seamlessly from test drives. After extensive debugging and optimization of the PyFTDI integration, the software prototype can now execute complete read cycles, handle error correction, and reconstruct recoverable data blocks. I validated the recovery process with multiple test scenarios including partially corrupted drives and drives with intermittent connection issues. The data recovery pipeline is now functional end-to-end, which represents a significant de-risking of our project goals.
However, we encountered a critical hardware setback this week. After extensive communication with the PCB manufacturer, I discovered that the USB connector we specified in our design is not rated for the reflow soldering temperatures required during board assembly. This issue was identified during the manufacturer’s design review process before fabrication began. The connector we selected has a maximum temperature rating of 260°C, but our lead-free reflow profile peaks at 245-250°C, which is too close to the limit and risks damaging the connector’s plastic housing during assembly.
I researched alternative USB connectors and identified a high-temperature rated replacement (rated to 280°C) that is pin-compatible with our existing design, requiring only minimal PCB footprint adjustments. I updated the schematic and PCB layout, verified the new connector maintains our impedance specifications for the USB differential pairs, and resubmitted the design to the manufacturer. This change added approximately 5 days to our fabrication timeline.
Is your progress on schedule or behind? If you are behind, what actions will be taken to catch up to the project schedule?
I am approximately 5 days behind schedule due to the USB connector temperature rating issue discovered during manufacturer review. The new expected board delivery date is now around November 19th, representing an additional delay beyond our previous November 14th target.
To mitigate this delay, I’ve taken several actions: First, since the imaging and data recovery code is now fully functional, I’m working with Apollo to expand our software test suite using simulated hardware responses, allowing us to validate edge cases and error conditions without waiting for physical boards. Second, I’ve confirmed with the manufacturer that the revised design has been fast-tracked through their review process to avoid any additional delays. Third, I’m pre-staging all components, test equipment, and bring-up procedures so we can begin validation immediately upon board arrival.
What deliverables do you hope to complete in the next week?
Next week I plan to:
- Complete comprehensive software documentation for the imaging and data recovery code, including API specifications and integration guides for Apollo
- Develop additional test cases for the software prototype covering corner cases like sudden disconnections during reads, drives with physical bad sectors, and drives requiring multiple recovery attempts
- Monitor the PCB fabrication status and confirm the high-temperature USB connector has been correctly installed during assembly
- Prepare a detailed board bring-up checklist that prioritizes safety verification (no shorts, correct voltage levels) before attempting USB enumeration with the new connector
- Create a contingency plan document outlining backup approaches if the new USB connector exhibits any issues during testing
- Work with Apollo to finalize the user interface for the data recovery tool so we can begin user testing as soon as hardware validation is complete