Fall 2000

Go to Blackboard CourseInfo 3.0

16-859/18-814 Microelectromechanical Systems


Instructors: Kaigham J. Gabriel, Porter Hall B25, x8-4241, kgabriel@cs.cmu.edu

Lectures: Tuesday and Thursday, 3:00 PM - 4:50 PM

Room: Baker Hall A51

Units: 12

Office Hours: By appointment (send email or meet after class)

TAs: George Lopez, Hamerschlag Hall 1209, x8-4405, glopez@cs.cmu.edu, (Office hours TBD)

Mike Stout, Hamerschlag Hall A203, x8-8194, mstout@andrew.cmu.edu, (OH TBD)

Secretary: Drew Danielson, Porter Hall B28, x8-2188, drew.danielson@cmu.edu

Text: Nadim Malouf, An Introduction to Microelectromechanical Systems Engineering, Artech House.

Website: http://courseinfo.web.cmu.edu/courses/18-814_16-859/

Prerequisites: Graduate standing in CIT or Robotics or permission from the instructor. The student is assumed to have a basic understanding of circuits and mechanics, and the willingness to cross engineering disciplines.

Course Description: The promise of better performance, lower cost, and miniaturization of sensor and actuator systems has motivated growth in the area of MicroElectroMechanical Systems (MEMS): silicon-based integrated microsystems. MEMS technology has broad applications such as inertial navigation, data storage, biochemical analysis, micromanipulation, optical displays, and microfluidic jet systems. This course is an introduction to MEMS, intended for first and second-year graduate students in CIT and Robotics who want the engineering background necessary for research in MEMS at Carnegie Mellon and elsewhere. Homework and an exam reinforce the engineering material taught in class. Students choose a research topic to work on as part of the final project. The project will take the form of a conference-quality paper accompanied by an oral presentation to the class. Laboratories provide a practical, hands-on overview and experience in MEMS design, fabrication and testing.

Course topics: Bulk and surface micromachining; thin-film properties; micromechanical design; fabrication services; computer-aided design, modeling, and simulation; electrostatic, piezoelectric, and thermal actuation; capacitive, magnetic, and thermal sensing mechanisms; sensing circuits; noise sources; inertial sensors; resonant sensors; micro-optics; microfluidics.

Grading: Homework assignments 20%, Mid-term exam 30%, Laboratories 20%, Project report 20%, Project presentation 10%

Homework: Due in class

Final Project: The final project will detail your independent design, or your extension of theory, or your extensions in modeling or simulating MEMS.

Project Report: The project report must be in IEEE journal format, which can be found at http://www.ieee.com/pubs/authors.html. A maximum of eight pages is allowed. Design oriented reports should include:

Presentation: Fifteen-minute oral project presentations are scheduled for the last week of the semester. Overhead transparencies must be used in the presentations and handed in prior to the start of presentations so we can bind them together in a course technical proceedings volume.

Course Philosophy and General Comments

Course Schedule

Week 

Date 

Lecture

Reading

Assignments
due

8/29 

Overview; photolithography and layout 

Chapter 1

 
 

8/31 

Microfabrication unit processes

Chapter 3, pp. 41-55

 

9/5 

Micromachining I: bulk Si

Chapter 3, pp. 55-69

HW1

 

9/7 

Material properties

Chapter 2

 

9/12 

Micromachining II

Chapter 3, pp.69-85

HW2

 

9/14 

Beam mechanics 

   

9/19 

Numerical simulation I - Mechanics

 

HW3

 

9/21 

Capacitive sensing; electrostatic actuation

Chapter 4, pp.87-108

 

9/26* 

Numerical simulation II - Electrostatics

 

HW4

 

9/28 

Resonant microdevices

   

10/3

Inertial MEMS; Damping and noise

Chapter 4, pp.108-134

HW5

 

10/5 

CMOS micromachining

   

7

10/10 

Thermal MEMS

Chapter 4, pp.134-136, 147-159

HW6

 

10/12 

Acoustic and ultrasonic MEMS

   

10/17* 

MID-SEMESTER EXAM

   
 

10/19* 

MEMS interface electronics

   

10/24 

Behavioral simulation; NODAS

 

HW7

 

10/26 

Advanced layout and extraction

   

10 

10/31 

RF MEMS

Chapter 5, pp.176-183

HW8

 

11/2 

Optical microsystems

Chapter 4, pp.142-147 Chapter 5, pp.183-190

 

11 

11/7 

Probe-based MEMS

Chapter 5, pp.192-196

HW9

 

11/9 

Microfluidic systems

Chapter 5, pp.190-192

 

12

11/14* 

Bio-MEMS 

Chapter 5, pp.161-176

HW10

 

11/16 

Packaging

Chapter 6

 

13 

11/21 

VLSI Electromechanics

 

Presentation viewfoils

 

11/23 

Thanksgiving--- NO CLASS

   

14 

11/28 

Project presentations

   
 

11/30 

Project presentations

   

15 

12/5 

Project presentations

   
 

12/7 

Project presentations

   

16

12/12 

Final Report Due, Last Day of Class

 

Final Report

NO FINAL EXAM


Revised: August 27, 2000 by kgabriel@cs.cmu.edu