Fall 2000 |
Instructors: Kaigham J. Gabriel, Porter Hall B25, x8-4241, kgabriel@cs.cmu.edu
Lectures: Tuesday and Thursday, 3:00 PM - 4:50 PM
Room: Baker Hall A51
Units: 12
Office Hours: By appointment (send email or meet after class)
TAs: George Lopez, Hamerschlag Hall 1209, x8-4405, glopez@cs.cmu.edu, (Office hours TBD)
Mike Stout, Hamerschlag Hall A203, x8-8194, mstout@andrew.cmu.edu, (OH TBD)
Secretary: Drew Danielson, Porter Hall B28, x8-2188, drew.danielson@cmu.edu
Text: Nadim Malouf, An Introduction to Microelectromechanical Systems Engineering, Artech House.
Website: http://courseinfo.web.cmu.edu/courses/18-814_16-859/
Prerequisites: Graduate standing in CIT or Robotics or permission from the instructor. The student is assumed to have a basic understanding of circuits and mechanics, and the willingness to cross engineering disciplines.
Course Description: The promise of better performance, lower cost, and miniaturization of sensor and actuator systems has motivated growth in the area of MicroElectroMechanical Systems (MEMS): silicon-based integrated microsystems. MEMS technology has broad applications such as inertial navigation, data storage, biochemical analysis, micromanipulation, optical displays, and microfluidic jet systems. This course is an introduction to MEMS, intended for first and second-year graduate students in CIT and Robotics who want the engineering background necessary for research in MEMS at Carnegie Mellon and elsewhere. Homework and an exam reinforce the engineering material taught in class. Students choose a research topic to work on as part of the final project. The project will take the form of a conference-quality paper accompanied by an oral presentation to the class. Laboratories provide a practical, hands-on overview and experience in MEMS design, fabrication and testing.
Course topics: Bulk and surface micromachining; thin-film properties; micromechanical design; fabrication services; computer-aided design, modeling, and simulation; electrostatic, piezoelectric, and thermal actuation; capacitive, magnetic, and thermal sensing mechanisms; sensing circuits; noise sources; inertial sensors; resonant sensors; micro-optics; microfluidics.
Grading: Homework assignments 20%, Mid-term exam 30%, Laboratories 20%, Project report 20%, Project presentation 10%
Homework: Due in class
Final Project: The final project will detail your independent design, or your extension of theory, or your extensions in modeling or simulating MEMS.
Project Report: The project report must be in IEEE journal format, which can be found at http://www.ieee.com/pubs/authors.html. A maximum of eight pages is allowed. Design oriented reports should include:
Presentation: Fifteen-minute oral project presentations are scheduled for the last week of the semester. Overhead transparencies must be used in the presentations and handed in prior to the start of presentations so we can bind them together in a course technical proceedings volume.
Course Philosophy and General Comments
Date |
Lecture |
Reading |
Assignments |
|
1 |
8/29 |
Overview; photolithography and layout |
Chapter 1 |
|
8/31 |
Microfabrication unit processes |
Chapter 3, pp. 41-55 |
||
2 |
9/5 |
Micromachining I: bulk Si |
Chapter 3, pp. 55-69 |
HW1 |
9/7 |
Material properties |
Chapter 2 |
||
3 |
9/12 |
Micromachining II |
Chapter 3, pp.69-85 |
HW2 |
9/14 |
Beam mechanics |
|||
4 |
9/19 |
Numerical simulation I - Mechanics |
HW3 |
|
9/21 |
Capacitive sensing; electrostatic actuation |
Chapter 4, pp.87-108 |
||
5 |
9/26* |
Numerical simulation II - Electrostatics |
HW4 |
|
9/28 |
Resonant microdevices |
|||
6 |
10/3 |
Inertial MEMS; Damping and noise |
Chapter 4, pp.108-134 |
HW5 |
10/5 |
CMOS micromachining |
|||
7 |
10/10 |
Thermal MEMS |
Chapter 4, pp.134-136, 147-159 |
HW6 |
10/12 |
Acoustic and ultrasonic MEMS |
|||
8 |
10/17* |
MID-SEMESTER EXAM |
||
10/19* |
MEMS interface electronics |
|||
9 |
10/24 |
Behavioral simulation; NODAS |
HW7 |
|
10/26 |
Advanced layout and extraction |
|||
10 |
10/31 |
RF MEMS |
Chapter 5, pp.176-183 |
HW8 |
11/2 |
Optical microsystems |
Chapter 4, pp.142-147 Chapter 5, pp.183-190 |
||
11 |
11/7 |
Probe-based MEMS |
Chapter 5, pp.192-196 |
HW9 |
11/9 |
Microfluidic systems |
Chapter 5, pp.190-192 |
||
12 |
11/14* |
Bio-MEMS |
Chapter 5, pp.161-176 |
HW10 |
11/16 |
Packaging |
Chapter 6 |
||
13 |
11/21 |
VLSI Electromechanics |
Presentation viewfoils |
|
11/23 |
Thanksgiving--- NO CLASS |
|||
14 |
11/28 |
Project presentations |
||
11/30 |
Project presentations |
|||
15 |
12/5 |
Project presentations |
||
12/7 |
Project presentations |
|||
16 |
12/12 |
Final Report Due, Last Day of Class |
Final Report |
|
NO FINAL EXAM |