This week I finished all of the routing of the PCB and ordered it [final version attached]. After routing I went through our completion checklist (pours, rechecked documentation for all pinouts, ran ERC and DRC, ensured trace width safety of 10 mils, and all relevant silkscreening was included). There were a few challenges with Fusion 360 during this checklist but I managed to resolve all issues (e.g. errant wire stubs that simply would not disappear, heavily cleaned up routing, and re-organization of components and pins). When it came to ordering we faced another challenge with realizing manufacturing time was not built into the previous OshPark measurements we had looked into previously. This led to us weighing the costs of different sped up manufactoring options vs possibly pivoting back to JLCPCB from China but facing the risk of getting our PCB stuck at customs similar to other PCB orders from CMU. However, after a team discussion I went forward with the expedited order option and hope to have it arrive and start soldering immediately after Carnival.
The rest of our ordered parts also arrived, the new SD Card Reader, SD Cards and SMD resistors.
I also prepared for our Interim Demo by creating slides for our use case and my progress. I plan to distribute print outs of our PCB design iteration process and talk through the challenges faced and the different changes between each of them. I think this well encapsulates the work I’ve put in for this project over the past few months. I also plan to lay each of the individual parts out (rotary encoder, MAX7219, SD card reader, LEDs, resistors etc) so that our showcase would display a clear idea of what our PCB consisted of.
This week I plan to work on our Interim Demo and help with overall Capstone tasks. That would include start thinking about our Final Presentation, individually test our GPIO and figure out the new SD cards and reader integration.
