Completed interface PCB layout passing general design rules.
Things I kept in mind to mitigate EMI and clean high frequency signals:
- Routing on single layer with no vias, keeping traces straight and short as possible for priority high frequency signals (clock signals)
- Careful part selection with low esr (equivalent series resistance) capacitors and generally compact 0603 to 0402 packages
- Decoupling capacitors located immediately next to corresponding pins on the same layer, each with its own 3V3 power via
- xtal crystal oscillators immediately next to pins on the same layer
- Continuous solid ground plane on layer 2
- Matching trace lengths and series resistors
- Bulk tantalum capacitors on input power supplies
- Ferrite beads for clean analog power pins
On schedule, will finalize design with team and order boards + components.
